Heat sink module

ABSTRACT

A heat sink module has a heat dissipation performance by a thermal conducting tube with a vacuum and a cooling fluid therein. The thermal conducting tube corresponds to a center of a CPU, so most of the heat from the CPU is able to be dissipated quickly to keep the CPU in a normal operating temperature range.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a heat sink module and moreparticularly to a heat sink module that is adapted to be retained on aCPU with a fast computing speed and effectively carries heat away fromthe CPU.

[0003] 2. Description of Related Art

[0004] As semiconductor technology has developed, CPUs with giga-Hzcomputing speeds have denser integrated circuitry with an accompanyinghigh heat problem when the CPU is operating.

[0005] Usually, a common heat sink with multiple fins and a fan wasmounted on early CPU products so that heat was dissipated from the CPUin a timely manner. However, the common heat sink is not able toeffectively dissipate the higher heat from the giga-Hz CPU. If that heatis not dispersed quickly the CPU will quickly overheat and malfunctionthereby leading to considerable inconvenience and cost to the user. Withthe increasing popularity of CPUs with high computing speeds nowadays, aproblem arises in that the CPUs generate more heat than the early CPUproducts.

[0006] The present invention provides a compact and efficient heat sinkmodule to mitigate and obviate the aforementioned problems.

SUMMARY OF THE INVENTION

[0007] The objective of the present invention is to provide an effectiveheat sink module for quickly dispersing heat from a CPU having fastcomputing speeds. The invention uses a hollow and vacuum thermalconducting body corresponding to the center of the CPU.

[0008] Other objects, advantages, and novel features of the inventionwill become more apparent from the following detailed description whentaken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009]FIG. 1 is an exploded perspective view of a first embodiment ofthe heat sink module in accordance with the present invention;

[0010]FIG. 2 is a perspective view of the heat sink module in FIG. 1;

[0011]FIG. 3 is a cross sectional side plan view of the heat sink modulein FIG. 1 mounted on a CPU;

[0012]FIG. 4 is a perspective view of the heat sink module in FIG. 1with a fan;

[0013]FIG. 5 is a perspective view of a second embodiment of the heatsink module in accordance with the present invention;

[0014]FIG. 6 is a cross sectional side plan view of the heat sink modulein FIG. 5; and

[0015]FIG. 7 is a perspective view of the heat sink module in FIG. 5with a fan.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0016] With reference to FIGS. 1, 2 and 3, a first embodiment of a heatsink module includes a base (10), a thermal conducting tube (11) and acover (12). The base (10) is connected separably to a CPU (30). Thethermal conducting tube (11) is hollow, has an open end and a closedend, a chamber (110) is defined in the thermal conducting tube (11) andis connected to the base (10). The cover (12) seals the open end of thethermal conducting tube (11) to make the chamber (110) airtight.

[0017] A hole (101) is defined in the base (10) to mount the thermalconducting tube (11). The thermal conducting tube (11) has a rough innerface of to provide a greater area of the thermal conducting tube (11) todissipate heat. A cooling fluid (40) is put into the chamber (110) butdoes not fill the chamber (110). Then a vacuum is drawn on the remainingspace in the chamber (110) to conduct the heat quickly to the coolingfluid (40).

[0018] When the base (10) is mounted on the CPU (30), the hole (101)corresponds to a center of the CPU (30). The temperature at the centerof the CPU (30) is higher than any other portion of the CPU (30).Therefore the thermal conducting tube (11) is able to directly dissipateheat quickly from the CPU (30), and the temperature of the CPU (30) canbe maintained in a normal range during operation of the CPU. Withreference to FIG. 4, a fan (20) is mounted on the base (10) near thethermal conducting tube (11) to disperse heat from the thermalconducting tube (11).

[0019] With reference to FIG. 5, a second embodiment of the heat sinkmodule comprises a base (10 a), a thermal conducting tube (11 a), acover (12 a) and multiple conducting plates (13). The base (10 a),thermal conducting tube (11 a) and cover (12 a) are the same as thefirst embodiment of the heat sink module. The U shape conducting platesare stacked on the base (10 a) and connected to the thermal conductingtube (11 a).

[0020] With reference to FIG. 6, a through hole (131) is defined in eachconducting plate (131) to fit around the thermal conducting tube (11 a).Besides, because each conducting plate is U shape, when the conductingplates (13) are stacked together, a gap (132) is formed between adjacentconducting plates (13) to facilitate dispersing heat from the conductingplates (13).

[0021] With reference to FIG. 7, a fan (20 a) mounted with theconducting plates (13) to quickly carry heat away from each of theconducting plate (13) through the gap (132).

[0022] Although the present invention has been explained in relation toits preferred embodiment, it is to be understood that many otherpossible modifications and variations can be made without departing fromthe spirit and scope of the invention as hereinafter claimed.

What is claimed is:
 1. A heat sink module, comprising: a base adapted tobe mounted on a CPU; a thermal conducting body secured to the base,which is hollow and airtight and has a vacuum chamber, wherein coolingfluid is put into the vacuum chamber to dissipate heat from the CPUquickly.
 2. The heat sink module as claimed in claim 1, wherein a holecorresponding to a center of the CPU is defined in the base, and thethermal conducting body is retained in the hole and corresponds to thecenter of the CPU.
 3. The heat sink module as claimed in claim 1,wherein conducting plates are stacked together on the base and eachconnects to the thermal conducting body.
 4. The heat sink module asclaimed in claim 1, wherein a through hole is defined in each of theconducting plates to pass around the thermal conducting body.
 5. Theheat sink module as claimed in claim 3, wherein each conducting plate isU shape, when stacked together a gap is defined between two adjacentconducting plates.
 6. The heat sink module as claimed in claim 1,wherein combinations of the thermal conducting body comprise a thermalconducting tube having an open end and a cover sealed on the open end.7. The heat sink module as claimed in claim 6, wherein the tube furthercomprises a rough inner face.
 8. The heat sink module as claimed inclaim 1, further comprising a fan connecting to the base and correspondsto the thermal conducting body.
 9. The heat sink module as claimed inclaim 3, further comprising a fan connecting to the base and correspondsto the thermal conducting body.